Invention Grant
- Patent Title: Multilayer electronic structures with embedded filters
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Application No.: US13962316Application Date: 2013-08-08
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Publication No.: US10014843B2Publication Date: 2018-07-03
- Inventor: Dror Hurwitz , Alex Huang
- Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Applicant Address: CN Zhuhai
- Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee Address: CN Zhuhai
- Agency: Wiggin and Dana LLP
- Agent Gregory S. Rosenblatt; Andrew D. Bochner
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H03H3/00 ; H01L27/01 ; H03H1/00 ; H01L49/02

Abstract:
A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter;the at least one capacitor being sandwiched between the at least one feature layer and at least one via in said at least adjacent via layer, such that the at least one via stands on the at least one capacitor, and the at least one of the first feature layer and the adjacent via layer includes at least one inductor extending in the XY plane.
Public/Granted literature
- US20150042415A1 Multilayer Electronic Structures with Embedded Filters Public/Granted day:2015-02-12
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