Invention Grant
- Patent Title: High-frequency module
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Application No.: US15643629Application Date: 2017-07-07
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Publication No.: US10014902B2Publication Date: 2018-07-03
- Inventor: Masashi Hayakawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2015-015781 20150129
- Main IPC: H04B1/44
- IPC: H04B1/44

Abstract:
A high-frequency module includes a directivity switching switch unit that switches an end portion of a first sub line, which is connected to an output terminal, and first and second resistor switching switch units that switch first and second termination resistors which are connected to the first sub line. The directivity of coupled output in the first sub line of a first directional coupler is able to be switched and detection accuracy of a high-frequency signal is able to be improved by improving isolation characteristics of the first directional coupler to improve the directivity.
Public/Granted literature
- US20170310355A1 HIGH-FREQUENCY MODULE Public/Granted day:2017-10-26
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