Invention Grant
- Patent Title: Imaging module, manufacturing method of imaging module, and electronic device
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Application No.: US15205779Application Date: 2016-07-08
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Publication No.: US10015401B2Publication Date: 2018-07-03
- Inventor: Yoshiyuki Takase , Kiyoto Sato , Tatsuya Fujinami
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2014-002449 20140109
- Main IPC: H04N5/232
- IPC: H04N5/232 ; G03B17/02 ; H04N5/225 ; G01B11/27 ; G02B7/04 ; G02B27/64 ; G02B7/08 ; H04N17/00

Abstract:
An imaging module 100 includes a lens unit 10 which has a lens group 12, and an imaging element unit 20 which is fixed to the lens unit 10 and has an imaging element 27 which images a subject through the lens group 12. The lens unit 10 has a lens drive unit 16, and a flexible substrate 13A which includes a wiring group 13a which is electrically connected to the lens drive unit 16. The imaging element unit 20 has a wiring connection portion 24 which is electrically connected to the wiring group 13a included in the flexible substrate 13A. The flexible substrate 13A is folded in the middle of the flexible substrate 13A.
Public/Granted literature
- US20160323511A1 IMAGING MODULE, MANUFACTURING METHOD OF IMAGING MODULE, AND ELECTRONIC DEVICE Public/Granted day:2016-11-03
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