Invention Grant
- Patent Title: Headphone assembly with interchangeable earpiece module
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Application No.: US15399288Application Date: 2017-01-05
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Publication No.: US10015580B1Publication Date: 2018-07-03
- Inventor: Joseph R. Bruno
- Applicant: Joseph R. Bruno
- Agency: Husch Blackwell LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033
Abstract:
The present invention is a headphone assembly comprising a headband for fitting around the head of the user, a first earpiece module detachably connected to the first end of the headband, and a second earpiece module detachably connected to the second end of the headband.
Public/Granted literature
- US20180192180A1 HEADPHONE ASSEMBLY WITH INTERCHANGEABLE EARPIECE MODULE Public/Granted day:2018-07-05
Information query
