The current embodiments provide an assembly for cooling a printed circuit board with at least one electronic component disposed on a first surface of the printed circuit board. The assembly may have a housing with first and second elastic elements and a cooling element configured to cool the at least one electronic component. The printed circuit board may be held between the first and second elastic elements in the housing. The assembly may further have at least one cooling surface region protruding from the cooling element and facing toward a second surface facing opposite the first surface of the printed circuit board in a region opposite of the electronic component.