Invention Grant
- Patent Title: Printed circuit board including embedded electronic component and method for manufacturing the same
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Application No.: US14073206Application Date: 2013-11-06
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Publication No.: US10015884B2Publication Date: 2018-07-03
- Inventor: Seung Eun Lee , Yee Na Shin , Yul Kyo Chung , Doo Hwan Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0155031 20121227
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01G4/228 ; H05K1/18 ; H05K3/46 ; H01L21/56

Abstract:
Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.
Public/Granted literature
- US20140182911A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-07-03
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