Invention Grant
- Patent Title: Printed circuit board, and method for manufacturing same
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Application No.: US14655627Application Date: 2013-12-20
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Publication No.: US10015885B2Publication Date: 2018-07-03
- Inventor: Won Suk Jung , Yun Ho An , Sang Myung Lee , Joon Wook Han
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2012-0152907 20121226
- International Application: PCT/KR2013/011913 WO 20131220
- International Announcement: WO2014/104654 WO 20140703
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K3/46 ; H05K3/30 ; H05K3/18

Abstract:
Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element; a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.
Public/Granted literature
- US20150334843A1 PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-11-19
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