Invention Grant
- Patent Title: Method of manufacturing conductive layer and wiring board
-
Application No.: US15541687Application Date: 2015-12-17
-
Publication No.: US10015890B2Publication Date: 2018-07-03
- Inventor: Masahiro Kaizu , Masateru Ichikawa
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: FUJIKURA LTD.
- Current Assignee: FUJIKURA LTD.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2015-000768 20150106
- International Application: PCT/JP2015/085372 WO 20151217
- International Announcement: WO2016/111133 WO 20160714
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/46 ; H05K3/10

Abstract:
A method of manufacturing a conductive layer on a support body includes a first process of forming a precursor layer containing at least one of metal particles and metal oxide particles on the support body; a second process of forming a sintering layer by irradiating an electromagnetic wave pulse on the precursor layer; and a third process of compressing the sintering layer. The conductive layer is formed by repeating the first to third processes “N” times, where “N” denotes a natural number equal to or greater than 2, on the same location of the support body, and the third process performed in the first to (N−1)th operations includes forming a surface of the sintering layer in an uneven shape.
Public/Granted literature
- US20180027668A1 METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD Public/Granted day:2018-01-25
Information query