A heat dissipating device includes a thermal conductive substance, a plurality of heat-radiating protrusions and a plurality of turbulence-generating structures. The thermal conductive substance has a first surface and a second surface opposite to the first surface. The heat-radiating protrusions are integrally formed with the thermal conductive substance on the first surface. At least one of the turbulence-generating structures is formed on the first surface of the thermal conductive substance in concaved manner, and arranged around a bottom periphery of the heat-radiating protrusions, so as to obstruct a development of a boundary layer around the bottom of the heat-radiating protrusions.