- Patent Title: Enclosures and methods of managing heat in heat generating modules
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Application No.: US15017198Application Date: 2016-02-05
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Publication No.: US10015914B2Publication Date: 2018-07-03
- Inventor: Arunkumar Biragoni , Adarsh Khandelwal
- Applicant: Emerson Network Power, Energy Systems, North America, Inc.
- Applicant Address: US IL Lombard
- Assignee: VERTIV ENERGY SYSTEMS, INC.
- Current Assignee: VERTIV ENERGY SYSTEMS, INC.
- Current Assignee Address: US IL Lombard
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: IN380/MUM/2015 20150205
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H02B1/56

Abstract:
An example enclosure includes a top portion, a bottom portion, and at least one heat generating module adjacent the top portion of the enclosure. The heat generating module includes an inlet side, an outlet side, a heat generating component and an internal fan. The enclosure also includes a heat collector positioned adjacent the outlet side of the heat generating module to collect warm air from the outlet side of the heat generating module and divert the warm air to the bottom portion of the enclosure to mix with cooler air. The internal fan of the heat generating module draws the mixed air into the heat generating module to create an airflow loop within the enclosure to cool the heat generating component without a heat sink, a heat exchanger, or a fan external to the heat generating module. Other example enclosures and methods of managing heat inside enclosures are also disclosed.
Public/Granted literature
- US20160234974A1 Enclosures And Methods Of Managing Heat In Heat Generating Modules Public/Granted day:2016-08-11
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