Invention Grant
- Patent Title: Die-cutting scrap removal device
-
Application No.: US15113535Application Date: 2014-04-28
-
Publication No.: US10016907B2Publication Date: 2018-07-10
- Inventor: Byung-jun Song , Ju-hyun Song
- Applicant: Byung-jun Song , Ju-hyun Song
- Agency: KORUS Patent, LLC
- Agent Seong Il Jeong
- Priority: KR10-2014-0007547 20140122
- International Application: PCT/KR2014/003735 WO 20140428
- International Announcement: WO2015/111802 WO 20150730
- Main IPC: B26D7/18
- IPC: B26D7/18 ; B31B100/00 ; B31B50/14 ; B31B110/35

Abstract:
A die-cutting scrap removal device for separating a product from an original plate is provided. The die-cutting scrap removal device includes a table-shaped removal main body part configured to stand upright on the ground surface; a first pressing-separation part fixed on the top surface of the removal main body part so as to move vertically; and a second pressing-separation part moving in the back and forth directions and the vertical direction on the top surface of the removal main body part, thereby readily separating scraps in mass quantities of products.
Public/Granted literature
- US20170008185A1 DIE-CUTTING SCRAP REMOVAL DEVICE Public/Granted day:2017-01-12
Information query