Invention Grant
- Patent Title: Method of injecting sealing gel into recess
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Application No.: US14337716Application Date: 2014-07-22
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Publication No.: US10016917B2Publication Date: 2018-07-10
- Inventor: Dandan Zhang , Lvhai Hu , Fengchun Xie
- Applicant: Tyco Electronics (Shanghai) Co Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agent Barley Snyder
- Priority: CN2013103085223 20130722
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/64 ; B29C45/72 ; B29D99/00 ; B29K101/12 ; B29K105/00 ; B29L31/26
Abstract:
A method of injecting a sealing gel into a predetermined structure for a work piece is provided. The method includes the following steps: providing a molding tool with an insertion structure shaped with respect to compliment the predetermined structure, enclosing a local region of a recess of the work piece with the molding tool, injecting a fluid sealing gel into the molding tool, and dismantling the molding tool after the sealing gel has cooled to a solid state.
Public/Granted literature
- US20150021819A1 Method of Injecting Sealing Gel Into Recess Public/Granted day:2015-01-22
Information query
