Invention Grant
- Patent Title: Hot-melt adhesive agent
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Application No.: US14944526Application Date: 2015-11-18
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Publication No.: US10017672B2Publication Date: 2018-07-10
- Inventor: Masahiro Moriguchi , Naohiro Maeda
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: JP2013-107764 20130522
- Main IPC: C09J153/02
- IPC: C09J153/02 ; B32B37/12 ; A61L15/58 ; C08L53/02

Abstract:
Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, excellent in adhesiveness at the wide temperature ranges (10 to 40° C.), and excellent in balance between tackiness and retention force, and a disposable product obtained by employing the hot-melt adhesive agent. Means for Solving the problem is a hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and has a viscosity at 25° C. as 25% toluene solution of not more than 250 mPa·s; and (A2) a triblock type styrene block copolymer.
Public/Granted literature
- US20160068723A1 HOT-MELT ADHESIVE AGENT Public/Granted day:2016-03-10
Information query
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