Invention Grant
- Patent Title: Gas barrier film and method of manufacturing gas barrier film
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Application No.: US15270001Application Date: 2016-09-20
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Publication No.: US10017854B2Publication Date: 2018-07-10
- Inventor: Seigo Nakamura , Yoshihiko Mochizuki , Atsushi Mukai
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2014-059541 20140324
- Main IPC: C23C16/40
- IPC: C23C16/40 ; C23C16/505 ; C23C16/34 ; C23C16/30

Abstract:
A gas barrier film includes a substrate film and an inorganic layer, in which the inorganic layer includes Si, N, H, and O, the inorganic layer includes a uniform region having a thickness of more than 5 nm at the center in a thickness direction, in the uniform region, a ratio of Si, N, H, and O is uniform and an O proportion is low, and either or both interface-contact regions of the inorganic layer are oxygen-containing regions in which the O proportion represented by the expression “O Proportion: (Number of O/Total Number of Si, N, and O)×100%” increases in a direction from the uniform region side to an interface and in which a variation of the O proportion per unit thickness is 2%/nm to 8%/nm.
Public/Granted literature
- US20170009339A1 GAS BARRIER FILM AND METHOD OF MANUFACTURING GAS BARRIER FILM Public/Granted day:2017-01-12
Information query
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