Invention Grant
- Patent Title: Vapor chamber structure
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Application No.: US15260184Application Date: 2016-09-08
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Publication No.: US10018427B2Publication Date: 2018-07-10
- Inventor: Chun-Hung Lin
- Applicant: TAIWAN MICROLOOPS CORP.
- Applicant Address: TW New Taipei
- Assignee: TAIWAN MICROLOOPS CORP.
- Current Assignee: TAIWAN MICROLOOPS CORP.
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR SERVICES
- Agent Chun-Ming Shih
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28D15/04 ; H05K7/20

Abstract:
A vapor chamber structure includes an upper metal casing, a lower metal casing, a partition plate and a working fluid. The lower metal casing is engaged and sealed with the upper metal casing, and a containing chamber is formed between the upper metal casing and the lower metal casing. The partition plate is laid inside the containing chamber and includes a gas channel configured to be facing the upper metal casing. The working fluid is filled in the containing chamber. Therefore, the gas evaporated in the vapor chamber will move along a fixed path to prevent the occurrence of turbulence effectively.
Public/Granted literature
- US20180066898A1 VAPOR CHAMBER STRUCTURE Public/Granted day:2018-03-08
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