Invention Grant
- Patent Title: EUV mask and method for manufacturing same
-
Application No.: US15069482Application Date: 2016-03-14
-
Publication No.: US10018904B2Publication Date: 2018-07-10
- Inventor: Kosuke Takai
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Tokyo
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2015-154157 20150804
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/22

Abstract:
An EUV mask according to an embodiment includes a substrate, a first line-shaped portion provided on the substrate, a second line-shaped portion provided on the substrate, a first sidewall disposed on a side surface of the first line-shaped portion, and a second sidewall disposed on a side surface of the second line-shaped portion. A first layer and a second layer are stacked in the first and second line-shaped portions. The first layer includes a first material. The second layer includes a second material. The first and second sidewalls include an oxide of the first material and cover a side surface of the first layer and a side surface of the second layer.
Public/Granted literature
- US20170038671A1 EUV MASK AND METHOD FOR MANUFACTURING SAME Public/Granted day:2017-02-09
Information query