Invention Grant
- Patent Title: Internal frame structure with heat insulation effect and electronic apparatus with the internal frame structure
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Application No.: US14828499Application Date: 2015-08-17
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Publication No.: US10019046B2Publication Date: 2018-07-10
- Inventor: Ching-Hang Shen
- Applicant: ASIA VITAL COMPONENTS CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G06F1/16 ; H04M1/02
Abstract:
An internal frame structure with heat insulation effect and an electronic apparatus with the internal frame structure. The internal frame includes a main body and a frame unit. A heat insulation layer is formed between the main body and the frame unit and positioned on at least two opposite sides of the main body. The heat insulation layer has a first side connected with the main body and a second side connected with the frame unit. The heat insulation layer serves to insulate the heat of the main body from being transferred to the frame unit.
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