Invention Grant
- Patent Title: Chip card sleeve
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Application No.: US15455157Application Date: 2017-03-10
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Publication No.: US10019664B2Publication Date: 2018-07-10
- Inventor: Peter Laackmann
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Priority: DE102014111487 20140812
- Main IPC: G06K19/077
- IPC: G06K19/077 ; G06K19/073 ; G06K19/07
Abstract:
A chip card sleeve including a cavity for holding a chip card, and a first contact and a second contact that extend into the cavity, wherein the first contact and the second contact are electrically conductively connected to one another.
Public/Granted literature
- US20170185883A1 Chip card sleeve Public/Granted day:2017-06-29
Information query
