Invention Grant
- Patent Title: Conductive polymer composite and substrate
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Application No.: US14822551Application Date: 2015-08-10
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Publication No.: US10020089B2Publication Date: 2018-07-10
- Inventor: Jun Hatakeyama , Koji Hasegawa , Takayuki Nagasawa
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-181535 20140905; JP2015-135156 20150706
- Main IPC: H01B1/12
- IPC: H01B1/12 ; C08L33/10 ; C08L25/08 ; C08L25/18 ; C08F12/08 ; C08F212/08 ; C08F8/36

Abstract:
The present invention provides a conductive polymer composite including (A) a π-conjugated polymer and (B) a dopant polymer which contains a repeating unit “a” represented by the following general formula (1) and has a weight-average molecular weight in the range of 1,000 to 500,000, wherein R1 represents a hydrogen atom or a methyl group; R2 represents a fluorine atom or a trifluoromethyl group; Z represents a single bond or —C(═O)—O—; “m” is an integer of 1 to 4; and “a” is a number satisfying 0
Public/Granted literature
- US20160071626A1 CONDUCTIVE POLYMER COMPOSITE AND SUBSTRATE Public/Granted day:2016-03-10
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