Invention Grant
- Patent Title: Substrate support assembly with deposited surface features
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Application No.: US14944018Application Date: 2015-11-17
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Publication No.: US10020218B2Publication Date: 2018-07-10
- Inventor: Wendell Glenn Boyd, Jr. , Vijay D. Parkhe , Teng-Fang Kuo , Zhenwen Ding
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H01L21/683 ; C03C17/00 ; H01L21/687

Abstract:
A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body. The method further includes disposing a mask over the coated ceramic coating, the mask comprising a plurality of elliptical holes and depositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges. The mask is then removed from the coated ceramic body and the plurality of elliptical mesas are polished.
Public/Granted literature
- US20170140970A1 SUBSTRATE SUPPORT ASSEMBLY WITH DEPOSITED SURFACE FEATURES Public/Granted day:2017-05-18
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