Invention Grant
- Patent Title: Polymer via plugs with high thermal integrity
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Application No.: US13431583Application Date: 2012-03-27
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Publication No.: US10020244B2Publication Date: 2018-07-10
- Inventor: Van Mieczkowski , Helmut Hagleitner , William T. Pulz
- Applicant: Van Mieczkowski , Helmut Hagleitner , William T. Pulz
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00
Abstract:
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that can withstand subsequent soldering and operating temperatures. The via plugs effectively fill the vias to prevent the vias from being filled substantially with solder during a subsequent soldering processes.
Public/Granted literature
- US20130256841A1 VIA PLUGS Public/Granted day:2013-10-03
Information query
IPC分类:
