A structure including a dual damascene feature in a dielectric layer, the dual damascene feature including a first via, a second via, and a trench, the first via, the second via being filled with a conductive material, a fuse line at the bottom of the trench on top of the first via and the second via, the fuse line including the conductive material; an insulating layer on top of the fuse line and along a sidewall of the trench, and a fill material on top of the insulating layer and substantially filling the trench.