Invention Grant
- Patent Title: Electronic component package
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Application No.: US15448039Application Date: 2017-03-02
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Publication No.: US10020272B2Publication Date: 2018-07-10
- Inventor: Yun Tae Lee , Moon Il Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0039274 20160331
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L23/00 ; H01L23/48 ; H01L23/31 ; H01L23/29

Abstract:
An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.
Public/Granted literature
- US20170287856A1 ELECTRONIC COMPONENT PACKAGE Public/Granted day:2017-10-05
Information query
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