- Patent Title: Circuit substrate and method for manufacturing circuit substrate
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Application No.: US15421018Application Date: 2017-01-31
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Publication No.: US10020277B2Publication Date: 2018-07-10
- Inventor: Daisuke Iguchi , Atsunori Hattori
- Applicant: FUJI XEROX CO., LTD. , NODA SCREEN CO., LTD.
- Applicant Address: JP Minato-ku, Tokyo JP Komaki-shi, Aichi
- Assignee: FUJI XEROX CO., LTD.,NODA SCREEN CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.,NODA SCREEN CO., LTD.
- Current Assignee Address: JP Minato-ku, Tokyo JP Komaki-shi, Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2016-019170 20160203
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/48 ; H01L23/492 ; H01L23/522 ; H01L23/528 ; H01L23/532

Abstract:
A circuit substrate includes: a base material; and a capacitor layer. The capacitor layer includes a first metal layer that is provided on the base material, a dielectric layer that is provided on the first metal layer, and a second metal layer that is provided on the dielectric layer. The first metal layer includes a first electrode region which is provided on the base material and is exposed from the dielectric layer and to which a first terminal of a capacitor element for supplying current to a circuit part through the capacitor layer is connected. The second metal layer includes a second electrode region in which the second metal layer is exposed and to which a second terminal of the capacitor element is connected.
Public/Granted literature
- US20170221848A1 CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE Public/Granted day:2017-08-03
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