Invention Grant
- Patent Title: Solid-state imaging device, method for manufacturing solid-state imaging device, and imaging apparatus
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Application No.: US15588384Application Date: 2017-05-05
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Publication No.: US10020334B2Publication Date: 2018-07-10
- Inventor: Takuji Matsumoto , Keiji Tatani , Yasushi Tateshita , Kazuichiro Itonaga
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2008-199520 20080801; JP2009-009523 20090120
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146 ; H04N5/378

Abstract:
A solid-state imaging device includes, in a semiconductor substrate, a pixel portion provided with a photoelectric conversion portion, which photoelectrically converts incident light to obtain an electric signal and a peripheral circuit portion disposed on the periphery of the pixel portion, wherein a gate insulating film of aMOS transistor in the peripheral circuit portion is composed of a silicon oxynitride film, a gate insulating film of aMOS transistor in the pixel portion is composed of a silicon oxynitride film, and an oxide film is disposed just above the photoelectric conversion portion in the pixel portion.
Public/Granted literature
- US20170243907A1 SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND IMAGING APPARATUS Public/Granted day:2017-08-24
Information query
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