Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method of solid-state imaging device and electronic apparatus
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Application No.: US15470535Application Date: 2017-03-27
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Publication No.: US10020339B2Publication Date: 2018-07-10
- Inventor: Takahiro Kawamura
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Michael Best & Friedrich LLP
- Priority: JP2013-185945 20130909
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148

Abstract:
A solid-state imaging device includes a pixel having a photoelectric conversion element which generates a charge in response to incident light, a first transfer gate which transfers the charge from the photoelectric conversion element to a charge holding section, and a second transfer gate which transfers the charge from the charge holding section to a floating diffusion. The first transfer gate includes a trench gate structure having at least two trench gate sections embedded in a depth direction of a semiconductor substrate, and the charge holding section includes a semiconductor region positioned between adjacent trench gate sections.
Public/Granted literature
- US20170200754A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2017-07-13
Information query
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