Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US15307303Application Date: 2014-12-15
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Publication No.: US10020367B2Publication Date: 2018-07-10
- Inventor: Kohei Ebihara , Akihiro Koyama , Hidenori Koketsu , Akemi Nagae , Kotaro Kawahara , Hiroshi Watanabe , Kensuke Taguchi , Shiro Hino
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-093252 20140430
- International Application: PCT/JP2014/083094 WO 20141215
- International Announcement: WO2015/166608 WO 20151105
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/872 ; H01L29/36 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
An object of the present invention is to provide a silicon carbide semiconductor device with which the electric field at the time of switching is relaxed and the element withstand voltage can be enhanced. The distance between the outer peripheral end of a second surface electrode and the inner peripheral end of a field insulation film is smaller than the distance between an outer peripheral end of the second surface electrode and an inner peripheral end of the field insulation film in the case where the electric field strength applied to the outer peripheral lower end of the second surface electrode is calculated so as to become equal to the smallest dielectric breakdown strength among the dielectric breakdown strength of the field insulation film and the dielectric breakdown strength of the surface protective film at the time of switching when the value of dV/dt is greater than or equal to 10 kV/μs.
Public/Granted literature
- US20170221998A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2017-08-03
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