Invention Grant
- Patent Title: Silicon carbide semiconductor element and manufacturing method thereof
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Application No.: US15364972Application Date: 2016-11-30
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Publication No.: US10020368B2Publication Date: 2018-07-10
- Inventor: Cheng-Tyng Yen , Chien-Chung Hung , Hsiang-Ting Hung , Yao-Feng Huang , Chwan-Ying Lee
- Applicant: Hestia Power Inc.
- Applicant Address: TW Hsinchu
- Assignee: HESTIA POWER INC.
- Current Assignee: HESTIA POWER INC.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW105101176A 20160115
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/10 ; H01L29/78 ; H01L29/08 ; H01L29/739 ; H01L29/04 ; H01L29/417 ; H01L21/04 ; H01L29/66

Abstract:
A silicon carbide (SiC) semiconductor element includes a semiconductor layer, a dielectric layer on a surface of the semiconductor layer, a gate electrode layer on the dielectric layer, a first doped region, a second doped region, a shallow doped region and a third doped region. The semiconductor layer is of a first conductivity type. The first doped region is of a second conductivity type and includes an upper doping boundary spaced from the surface by a first depth. The shallow doped region is of the second conductivity type, and extends from the surface to a shallow doped depth. The second doped region is adjacent to the shallow doped region and is at least partially in the first doped region. The third doped region is of the second conductivity type and at least partially overlaps the first doped region.
Public/Granted literature
- US20170207305A1 SILICON CARBIDE SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-07-20
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