Invention Grant
- Patent Title: Bonded patches with bond line control
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Application No.: US14335269Application Date: 2014-07-18
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Publication No.: US10022922B2Publication Date: 2018-07-17
- Inventor: Steven Donald Blanchard , Aydin Akdeniz , John Spalding , David M. Anderson , Michael W. Evens
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: B29C73/10
- IPC: B29C73/10 ; B29C73/12 ; B29C65/48 ; B29C65/52 ; B29C65/78 ; B29C65/00 ; C09J5/00 ; B29C65/18 ; B29C65/24 ; C09J5/06 ; B29L31/30 ; B29C35/02 ; B29K105/06 ; B29K105/16
Abstract:
A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.
Public/Granted literature
- US20140326389A1 BONDED PATCHES WITH BOND LINE CONTROL Public/Granted day:2014-11-06
Information query
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