Invention Grant
- Patent Title: Laminated structure manufacturing method, laminated structure, and electronic apparatus
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Application No.: US14387760Application Date: 2013-03-27
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Publication No.: US10022947B2Publication Date: 2018-07-17
- Inventor: Nozomi Kimura , Keisuke Shimizu , Toshio Fukuda
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-084583 20120403
- International Application: PCT/JP2013/002101 WO 20130327
- International Announcement: WO2013/150746 WO 20131010
- Main IPC: B44C1/00
- IPC: B44C1/00 ; B32B38/10 ; B32B38/18 ; B32B37/10 ; B32B37/24 ; B32B37/02 ; H01L21/18 ; H01L29/16 ; B32B9/00 ; B32B37/12 ; B32B37/00
Abstract:
There is provided a laminated structure manufacturing method including bonding a graphene film of one layer or a plurality of layers formed on a first substrate to a second substrate with an adhesive resin layer, removing the first substrate, and forming a transparent layer on the graphene film.
Public/Granted literature
- US20150064470A1 LAMINATED STRUCTURE MANUFACTURING METHOD, LAMINATED STRUCTURE, AND ELECTRONIC APPARATUS Public/Granted day:2015-03-05
Information query
