Invention Grant
- Patent Title: Liquid ejection head, liquid ejection apparatus, and manufacturing method
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Application No.: US15388792Application Date: 2016-12-22
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Publication No.: US10022979B2Publication Date: 2018-07-17
- Inventor: Shingo Okushima , Takatsuna Aoki , Seiichiro Karita , Noriyasu Nagai , Tamaki Sato , Tetsushi Ishikawa , Yasuaki Tominaga , Manabu Otsuka , Shuzo Iwanaga , Tatsurou Mori , Kazuhiro Yamada , Akira Yamamoto , Zentaro Tamenaga , Akio Saito
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2016-003077 20160108; JP2016-239697 20161209
- Main IPC: B41J2/185
- IPC: B41J2/185
Abstract:
A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.
Public/Granted literature
- US20170197439A1 LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD Public/Granted day:2017-07-13
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