Invention Grant
- Patent Title: Structures for reducing and avoiding stresses on the seal bottom side during laser reseal
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Application No.: US15333381Application Date: 2016-10-25
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Publication No.: US10023460B2Publication Date: 2018-07-17
- Inventor: Achim Breitling , Frank Reichenbach , Jochen Reinmuth , Julia Amthor
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: ROBERT BOSCH GMBH
- Current Assignee: ROBERT BOSCH GMBH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: DE102015220892 20151026
- Main IPC: G01L9/00
- IPC: G01L9/00 ; B81B7/00 ; B81C1/00 ; B81B7/02

Abstract:
A method for manufacturing a micromechanical component including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. An access opening connecting the first cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy or heat via laser into an absorbing part of the substrate or the cap. During the step for forming the access opening, a first access opening section is formed generally perpendicularly to a surface of the substrate or the cap, and a second access opening section is formed generally perpendicularly to and in parallel to the surface.
Public/Granted literature
- US20170113921A1 STRUCTURES FOR REDUCING AND AVOIDING STRESSES ON THE SEAL BOTTOM SIDE DURING LASER RESEAL Public/Granted day:2017-04-27
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