Invention Grant
- Patent Title: Filler powder and method for manufacturing same
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Application No.: US14889239Application Date: 2014-05-19
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Publication No.: US10023720B2Publication Date: 2018-07-17
- Inventor: Noriaki Masuda , Yohei Hosoda , Shingo Nakane , Hiroki Yamazaki
- Applicant: NIPPON ELECTRIC GLASS CO., LTD.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Keating and Bennett, LLP
- Priority: JP2013-108545 20130523; JP2013-244928 20131127; JP2014-075122 20140401; JP2014-097358 20140509
- International Application: PCT/JP2014/063176 WO 20140519
- International Announcement: WO2014/188991 WO 20141127
- Main IPC: C08K3/40
- IPC: C08K3/40 ; C08K7/20 ; C03C3/078 ; C03C3/083 ; C03C3/085 ; C03C3/097 ; C03C4/00 ; C03C10/00 ; C03C12/00 ; C03C3/06 ; C03C8/24 ; C09C1/28

Abstract:
Provided is a filler powder that has a lower coefficient of thermal expansion than silica powder and is less likely to cause quality and color alteration of a resin when blended into the resin. The filler powder is made of a crystallized glass in which β-quartz solid solution and/or β-eucryptite is precipitated. The filler powder preferably has an average particle size D50 of 5 μm or less. The filler powder preferably has a coefficient of thermal expansion of 5×10−7/° C. or less in a range of 30 to 150° C.
Public/Granted literature
- US20160083557A1 FILLER POWDER AND METHOD FOR MANUFACTURING SAME Public/Granted day:2016-03-24
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