Invention Grant
- Patent Title: Heat-conductive silicone composition
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Application No.: US14786676Application Date: 2014-05-02
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Publication No.: US10023741B2Publication Date: 2018-07-17
- Inventor: Keita Kitazawa , Kunihiro Yamada
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-109908 20130524; JP2013-147582 20130716
- International Application: PCT/JP2014/002397 WO 20140502
- International Announcement: WO2014/188667 WO 20141127
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08L83/04 ; C09K5/08 ; C08G77/12 ; C08G77/20 ; C08K3/08

Abstract:
A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G′ being measured by constructing a program for holding a sample at 150° C. for 7,200 seconds after the sample is heated from 25° C. to 125° C. at a temperature increase rate of 10° C./min, from 125° C. to 145° C. at a temperature increase rate of 2° C./min, and from 145° C. to 150° C. at a temperature increase rate of 0.5° C./min.
Public/Granted literature
- US09976032B2 Heat-conductive silicone composition Public/Granted day:2018-05-22
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