Invention Grant
- Patent Title: Apparatus and method for processing substrate
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Application No.: US14405958Application Date: 2013-07-08
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Publication No.: US10023957B2Publication Date: 2018-07-17
- Inventor: Mika Jauhiainen , Pekka Soininen
- Applicant: BENEQ OY
- Applicant Address: FI Espoo
- Assignee: BENEQ OY
- Current Assignee: BENEQ OY
- Current Assignee Address: FI Espoo
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Agent Robert P. Michal, Esq.
- Priority: FI20125786 20120709
- International Application: PCT/FI2013/050739 WO 20130708
- International Announcement: WO2014/009606 WO 20140116
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/458 ; C23C16/54

Abstract:
The present invention relates to an apparatus and method for processing a surface of a substrate by subjecting the surface to successive surface reactions of a first and second precursor. The apparatus includes a nozzle head having two or more precursor nozzles and a moving mechanism for moving the nozzle head in non-linear oscillating movement in a first and second movement direction between a first extreme position and a second extreme position via a center position. The moving mechanism includes first driving means for accelerating the nozzle head in the first moving direction and decelerating the nozzle head in the second moving direction and second driving means for accelerating the nozzle head in the second moving direction and decelerating the nozzle head in the first moving direction.
Public/Granted literature
- US20150167164A1 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE Public/Granted day:2015-06-18
Information query
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