Invention Grant
- Patent Title: Anti-electrostatic device and method for manufacturing the same, and array substrate
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Application No.: US15629975Application Date: 2017-06-22
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Publication No.: US10025152B2Publication Date: 2018-07-17
- Inventor: Xingfeng Ren , Senlin Wang
- Applicant: BOE Technology Group Co., Ltd. , Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Anhui
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Anhui
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201610005081 20160105
- Main IPC: H01L29/10
- IPC: H01L29/10 ; G02F1/1362 ; H01L27/02 ; H01L27/12 ; H01L21/4763 ; H01L29/24 ; H01L29/45 ; H01L21/4757 ; G02F1/1343 ; G02F1/1368 ; H01L29/786 ; H01L29/861 ; H01L29/66

Abstract:
An anti-electrostatic device used in an array substrate of a liquid crystal display and a method for manufacturing the same, and a substrate are disclosed. The method includes steps of: forming a first insulation layer on a first conductive layer; forming a pattern on the first insulation layer; forming an etching barrier layer on the pattern; forming a first via hole and a second via hole extending through the etching barrier layer, and forming a fifth via hole extending through the etching barrier layer and the first insulation layer; forming a second conductive layer on the etching barrier layer, wherein a first portion and a second portion of the second conductive layer are respectively electrically connected to the pattern via the first via hole and the second via hole, and one of them is electrically connected to the first conductive layer via a fifth via hole.
Public/Granted literature
- US20170293189A1 ANTI-ELECTROSTATIC DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ARRAY SUBSTRATE Public/Granted day:2017-10-12
Information query
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