A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30° C. or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity.