A fixing device includes fixing rotator, a heater to heat the fixing rotator, a pressure rotator disposed opposite an outer circumferential surface of the fixing rotator, a pressure pad disposed opposite an inner circumferential surface of the fixing rotator, a support to support the pressure pad, and a thermal conduction aid to conduct heat in an axial direction of the fixing rotator. The pressure pad presses against the pressure rotator via the fixing rotator to form a fixing nip between the fixing rotator and the pressure rotator. The pressure pad includes a nip-side face disposed opposite the inner circumferential surface of the fixing rotator. The thermal conduction aid covers the nip-side face of the pressure pad. The nip-side face of the pressure pad includes at least one mouth therein defining a non-contact area in which the pressure pad does not contact the thermal conduction aid.