Invention Grant
- Patent Title: System for simulating semiconductor device and related method of operation
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Application No.: US14153661Application Date: 2014-01-13
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Publication No.: US10025888B2Publication Date: 2018-07-17
- Inventor: Ui-Hui Kwon , Vasily Zabelin , Sachio Nagura , Keun-Ho Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2013-0024498 20130307
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A system for simulating a semiconductor device comprises a data input module configured to receive structural data of the semiconductor device comprising a first region and a second region, and a spatial discretization generating module configured to divide a space of the semiconductor device using the structural data through division of the first region into first type meshes and division of the second region into second type meshes different from the first type meshes.
Public/Granted literature
- US20140257784A1 SYSTEM FOR SIMULATING SEMICONDUCTOR DEVICE AND RELATED METHOD OF OPERATION Public/Granted day:2014-09-11
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