Invention Grant
- Patent Title: Electronic component with multilayered body
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Application No.: US14837525Application Date: 2015-08-27
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Publication No.: US10026538B2Publication Date: 2018-07-17
- Inventor: Kaori Takezawa
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2013-044978 20130307
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/29

Abstract:
A multilayer body is a lamination of a plurality of substantially rectangular insulating layers and has a bottom surface being a series of the outer edges of the insulating layers, an end surface being adjacent to the bottom surface and being a series of the outer edges of the insulating layers, and a side surface located on a negative side in the y-axis direction. An outer electrode is embedded in the multilayer body such that it is exposed while extending across the boundary between the bottom surface and the end surface. A coil is disposed in the multilayer body and is connected to the outer electrode. The distance between the outer electrode and the side surface in the corner between the bottom surface and the end surface is longer than the distance between the outer electrode and the side surface where the outer electrode and the coil are connected.
Public/Granted literature
- US20150371757A1 ELECTRONIC COMPONENT Public/Granted day:2015-12-24
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