- Patent Title: Apparatus with 3D wirewound inductor integrated within a substrate
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Application No.: US15160776Application Date: 2016-05-20
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Publication No.: US10026546B2Publication Date: 2018-07-17
- Inventor: Changhan Hobie Yun , Chengjie Zuo , Daeik Daniel Kim , Mario Francisco Velez , Niranjan Sunil Mudakatte , Jonghae Kim , David Francis Berdy
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorported
- Current Assignee: QUALCOMM Incorported
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated-Toler
- Main IPC: H03H7/46
- IPC: H03H7/46 ; H01F27/40 ; H01F27/28 ; H01F27/29 ; H01F41/02 ; H03H7/01
Abstract:
An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor.
Public/Granted literature
- US20170338034A1 APPARATUS WITH 3D WIREWOUND INDUCTOR INTEGRATED WITHIN A SUBSTRATE Public/Granted day:2017-11-23
Information query
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