Invention Grant
- Patent Title: Modular switch panel assembly
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Application No.: US15014418Application Date: 2016-02-03
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Publication No.: US10026569B2Publication Date: 2018-07-17
- Inventor: Thomas J. Danowski , George L. Cepynsky , Paul G. Cepynsky
- Applicant: Thomas J. Danowski , George L. Cepynsky , Paul G. Cepynsky
- Applicant Address: US IL Downers Grove
- Assignee: Precision Circuits Inc.
- Current Assignee: Precision Circuits Inc.
- Current Assignee Address: US IL Downers Grove
- Agency: Schiff Hardin LLP
- Main IPC: H01H13/70
- IPC: H01H13/70 ; H01H13/10 ; H01H13/04 ; H01H13/14

Abstract:
In a modular switch panel assembly, a switch cover with an aperture and a switch button having a button portion and an integral mounting portion are provided. The mounting portion comprises at least first and second spring members protruding laterally of and at opposite sides of the button portion. Each of the spring members has a meandering path shape and has one end integral with the button portion and an opposite end attached to the switch cover such that the button portion extends through the aperture. A printed circuit board has a switch, and is attached to the switch cover such that the switch is adjacent to a bottom surface of the switch button.
Public/Granted literature
- US20170221654A1 MODULAR SWITCH PANEL ASSEMBLY Public/Granted day:2017-08-03
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