The present invention relates to a method and a system for cleaning a semiconductor substrate wherein Al is at last partially exposed on a silicon substrate and silicided with a metallic substance without damaging the Al and a silicide layer. A cleaning portion cleans the aforementioned semiconductor substrate. A delivery portion, disposed on the cleaning portion, delivers a solution to the semiconductor substrate. A sulfuric acid solution transfer path connected onto the delivery portion transfers a sulfuric acid solution and an adsorptive inhibitor solution transfer path connected to the delivery path transfers an adsorptive inhibitor having any one or more of N-based, S-based, and P-based polar groups to the delivery portion. The sulfuric acid solution and the adsorptive inhibitor may be mixed or separately transferred to come into contact with the semiconductor substrate.