Invention Grant
- Patent Title: Wafer processing system and wafer processing method using same
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Application No.: US15406997Application Date: 2014-11-25
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Publication No.: US10026632B2Publication Date: 2018-07-17
- Inventor: Sang Hoon Shin , Heyun Su Jang , Chang Ho Lee , Hee Young Shin , Eun Jin Jung
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0102529 20140808
- International Application: PCT/KR2014/011369 WO 20141125
- International Announcement: WO2016/021778 WO 20160211
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306 ; H01L21/78 ; H01L21/304 ; H01L23/544 ; H01L21/027 ; H01L21/308 ; H01L21/02
Abstract:
A system for processing a wafer may use a wafer identification (ID) assigned by a wafer manufacturing company as an ID code of the wafer in managing the wafer by a semiconductor manufacturing company.
Public/Granted literature
- US20170178936A1 WAFER PROCESSING SYSTEM AND WAFER PROCESSING METHOD USING SAME Public/Granted day:2017-06-22
Information query
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