Invention Grant
- Patent Title: Structure and method for enhancing robustness of ESD device
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Application No.: US14596339Application Date: 2015-01-14
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Publication No.: US10026640B2Publication Date: 2018-07-17
- Inventor: Alexander Kalnitsky , Jen-Chou Tseng , Chia-Wei Hsu , Ming-Fu Tsai
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/762 ; H01L29/06 ; H01L29/73 ; H01L29/66

Abstract:
A method and structure of improving the robustness of an electrostatic discharge (ESD) protection device is disclosed. One aspect of the instant disclosure provides a semiconductor structure that comprises: a first well structure; a second well structure arranged adjacent to the isolation structure in the substrate, a diffusion region respectively disposed in the first and the second well structures; an isolation structure arranged between the well structures and laterally separating the diffusion regions; and a partition structure arranged in the isolation structure. The partition structure affects a steeper slope on a lateral surface of the isolation structure bordering at least one of the diffusion regions, thereby modifying a ballasting characteristic of the isolation structure.
Public/Granted literature
- US20160111411A1 STRUCTURE AND METHOD FOR ENHANCING ROBUSTNESS OF ESD DEVICE Public/Granted day:2016-04-21
Information query
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