Invention Grant
- Patent Title: Packages with through-vias having tapered ends
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Application No.: US15668315Application Date: 2017-08-03
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Publication No.: US10026646B2Publication Date: 2018-07-17
- Inventor: Hsien-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/332
- IPC: H01L21/332 ; H01L21/768 ; H01L25/10 ; H01L23/00
Abstract:
A package includes a device die, a molding material molding the device die therein, a through-via substantially penetrating through the molding material, wherein the through-via has an end. The end of the through-via is tapered and has rounded sidewall surfaces. The package further includes a redistribution line electrically coupled to the through-via.
Public/Granted literature
- US20170330793A1 Packages with Through-Vias Having Tapered Ends Public/Granted day:2017-11-16
Information query
IPC分类:
