A method of manufacturing a light-emitting device that includes a circuit board with p- and n-electrodes formed on a surface of a substrate and a light-emitting element connected to the p- and n-electrodes of the circuit board via a conductor member. The method includes forming two protrusions facing each other on both sides of a gap between the p- and n-electrodes of the circuit board, and dispensing a underfill at a position on an opposite side to the light-emitting element with respect to the two protrusions, allowing the dispensed underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions, and filling, by the capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom of the light-emitting element.