Invention Grant
- Patent Title: Cooling structure for integrated circuits and methods for forming such structure
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Application No.: US14978358Application Date: 2015-12-22
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Publication No.: US10026674B2Publication Date: 2018-07-17
- Inventor: Joseph M. Wahl , Travis L. Mayberry , Gregory G. Beninati
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L21/48 ; H01L23/367 ; H01L23/467 ; H01L23/473
Abstract:
A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.
Public/Granted literature
- US20170178996A1 COOLING STRUCTURE FOR INTEGRATED CIRCUITS AND METHODS FOR FORMING SUCH STRUCTURE Public/Granted day:2017-06-22
Information query
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