Invention Grant
- Patent Title: Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device
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Application No.: US15470494Application Date: 2017-03-27
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Publication No.: US10026679B2Publication Date: 2018-07-17
- Inventor: Fulvio Vittorio Fontana
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: ITTO2014A1106 20141224
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/498
Abstract:
A process for manufacturing a surface-mount electronic device includes forming a plurality of preliminary contact regions of a sinterable material on a supporting structure, the supporting structure being of a soluble type. A chip including a semiconductor body is mechanically coupled to the supporting structure. The sinterable material is sintered such that each preliminary contact region forms a corresponding sintered preliminary contact, and the chip and the plurality of preliminary contact regions are coated with a dielectric coating region, and the supporting structure is removed using a jet of liquid.
Public/Granted literature
- US20170200669A1 PROCESS FOR MANUFACTURING A PACKAGE FOR A SURFACE-MOUNT SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE Public/Granted day:2017-07-13
Information query
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