Package substrates including conductive interconnects having noncircular cross-sections, and integrated circuit packages incorporating such package substrates, are described. In an example, a conductive pillar having a noncircular pillar cross-section is electrically connected to an escape line routing layer. The escape line routing layer may include several series of conductive pads having noncircular pad cross-sections. Accordingly, conductive traces, e.g., strip line escapes and microstrip escapes, may be routed between the series of conductive pads in a single escape line routing layer.